DSC POWER 864 - REV2 Spezifikationen Seite 233

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Seitenansicht 232
© 2009 Microchip Technology Inc. Preliminary DS39927B-page 231
PIC24F16KA102 FAMILY
30.0 PACKAGING INFORMATION
30.1 Package Marking Information
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC24F16KA102
0910017
3
e
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC24F08KA
102-I/SS
0910017
3
e
20-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
20-Lead SSOP
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Example
PIC24F16KA
101-I/SS
0910017
3
e
-I/SP
Legend: XX...X Product-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
-I/P
PIC24F16KA101
0910017
3
e
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